Test Contactor & Contact Pin

VA offers highly reliable and low insertion force Test Contactors which utilize a variety of miniature double ended contact pins. Also offers a wide range of replaceable Spiral Spring Contact Probles to meet your high frequency testing requirements. These are excellent for production testing of semiconductor devices. VA is committed to provide a comprehensive and well designed test contactor solution depending on client's requirements.

• Using double ended spring loaded contacts
  
• Offer different tip style for various applications
  
• Minimized solder migration
  
• Consistent contact resistance & spring force throughout life cycle
  
• Customized to your unique need and requirement
  
• Short lead time and competitive price

Coming soon……

• QFP/QFN Test Contactor
  
• Membrane for cost effective testing
  
• Customize to customers' needs

Spiral Spring

With demanding electronics IC and miniaturization, the IC gets much smaller and the testing gets more rigorous. A new innovation to overcome the problem & to replace the pogo pin with a very small coil-shape Spiral Spring.

Features:-

• Short contact path - good electrical characteristic
  
• Suitable for fine pitch devices
  
• Suitable for high frequency testing
  
• High contact force: up to 75g for fine pitch devices
  
• Round circumference at both ends
  
• One pin size fits all solder balls of same pitch devices
  
• Eliminate damages on solder ball and dut board

Burn-In Socket

Plastronics Socket Company has been offering its customers state-of-the-art Burn-In Sockets for more than 30 years. Plastronics offers a wide range of socket types for ever more demanding reliability, test and production burn-in requirements.

• QFN socket for packages such as MLF, BCC, LPCC and etc.
  Sockets available in lidded and open top styles and have over 400 part types at over 250 customer locations around the world. In shorts, Plastronics offers the largest selection of QFN sockets in the industry
  
  
• Dual-row QFN and fine pitch LGA using Plastronics’ latest contact pin technology
  
  
• Full line of fine pitch BGA, available in 0.50 mm, 0.65 mm, 0.75 mm, 0.80 mm pitch configurations
  
  
• Sockets for LGA, LCC, PLCC, SOP, TQFP, TSOP and BGA devices of 1.00 mm, 1.27 mm and 1.5 mm pitch.
  Custom sockets/solutions for Thermal Management of BGA devices are also available. Please contact us for a more complete listing of ball matrixes and IC device sizes for each package type needed.

Whatever your technology path leads, Plastronics Socket Company has the right test and burn-in socket solution to meet your requirements.

Memory Module Test Solution

DY ELTEC Test Sockets are specially designed for leaded packages - QFP, SOIC, TSSOP, SSOP and etc. The special feature in DY sockets is its uniquely designed contact fingers. This contactor provides :-

• Firm contact on load board without damaging it
  
• Easy replacement
  
• Less process downtime and easy maintenance due to less frequent cleaning is required
  
• Longer life span
  
• Applicable to .4mm pitch devices

DY ELTEC also offers various types of Module Test Socket using contact fingers / pin-arrays concept. Customer can choose either machined type or molded type module socket to suit different application.

Open Short & leakage Tester

Performs the following:-

• Resistance: milli-ohm to Mega ohm
  
• Current Leakage: 50nA min
  
• Capacitance measurement
  
• Diode voltage in forward and reverse mode
  
• Open short between pins
  
• Average test time: 0.5msec

Functional Mixed Signal Tester

The "No Foot-print" full functional mixed signal tester:-

• Fast
  
• Low Cost
  
• No floor space
  
• Easy upgrade
  
• Low maintenance cost
  
• Low Entry cost
  
• Able to load with different modules to alter configuration for different tests.
  
• Can be configured to test ADC including sigma delta type, DAC, digital, opto, linear, high voltage / current devices
  
• Test include open, short, leakage, DC parametric and AC parametric
  
• Can be integrated to Trim Form handler for In Assembly Test

PA-2100 TEST HANDLER

Features :-

• Reliable High-Speed Pick & Place Handler
  
• Simultaneously Dual-Pick And Dual-Place Design
  
• Small Size IC Handling Capability
  
• Friendly User Interface (Chinese & English)
  
• Worry-Free Solution For High-Frequency Device Testing
  
• Integrated Solution for CMOS image Sensor (CIS)
  
• Common Use The NS-5000/6000 Change Kits
  
• Achieve The Real Time Monitor
  
• Feel-Free robot Teaching and Alignment
  
• Auto contact force learning
  
• Complete Technology Support Of Software And Hardware