Conductive / Convection Ovens

SIKAMA's innovative line of reflow soldering systems includes both straight conduction systems and Sikama's patented Conduction + Convection furnaces.

Many of their systems are available with liquid cooling and optional software control for both data logging and remote operation, as well as an optional speed/time dwell mode.

Precise temperature controls, repeatable profiles, clean solder bonds, and efficient, cost-effective operation are the design goals for all machines - goals that were met by developing new technology and working closely with their customers.

All Sikama reflow soldering systems generate consistent, accurate temperature profiles using various numbers of heating and cooling zones, allowing you to tailor the system to the exact needs of your substrate and solder.

Sikama International has developed a new line of reflow solder systems known as the Falcon 8000 Series.

The 8000 Series consists of the 8100 (10 heat zones) and the 8500 (5 heat zones).

Each system includes automatic load and unload buffers with appropriate sensors providing SMEMA interface connection to link into automated production lines.

Sikama Wafer Bumping System

For 4 inch to 12 inch wafer bumping lines. With the introductions of their 2 latest tools, the IWH 48 (indexing wafer handler) and the ICS 412 (inline coating system), along with the FALCON 1200 reflow furnace, Eberts is also able to provide indexer to indexer capabilities without having to rely on other manufacturers to provide tools as part of the line.

Latest Type of Transportation System

• Substrate is picked up and moved from zone to zone 
  
• Eliminates backside scratching or wear of product/fixtures
  
• Simplified maintenance and cleaning
  
• Eliminates product breakage
  
• SMEMA compatible
  
• Simple robust design