Dicing System

Kobay-SAWIN offers state-of-the-art dicing machines, available in semi-automatic or fully automatic versions.

All systems are equipped with vision cameras and PRS (Pattern Recognition System), allowing automatic alignment and quality inspection.

The operation interface is a 15" LCD flat screen and keyboard.

The high-precision XY-table, based on the principle of single built-in die cast, rigid for a stable and reliable dicing process combined with a front-mounted spindle allows unmatched accuracy.

Dicing System

  • The Ultimate choice for automatic dual Spindle dicing machine
  • Dual spindle with horizontal mounting on " Bridge" Structure
  • User friendly & intelligent software system
  • Maximum Utilization
   

Dicing Paste / Tape

AI Technology manufactures flexible “Stress-free” adhesives, films, pastes and thermal films, gels/grease. Adhesives are electrically conductive or insulating and applicable for die-attach, lid sealing, BGA, multichip modules, and wafer lamination. Solder-Sub™ and Chip-Coupler™ applications available. Other products include custom carriers; wafer dicing tape and UV curing adhesives and tape. The latest product developed is an epoxy flex substrate that is 1/3 the cost of typical high temperature flex circuits.

Products

  • Die Attach Rapid
    curing and low stress
  • Thermal Interface & Adhesive
    Compressible phase-change and in-situ curing pads
  • Substrate & Electronic Adhesive
    Flexible epoxy and thermoplastic adhesives
  • Flip-Chip Interconnection
    Flexible conductive adhesive and solderable interposer
  • Lid-Attach Preform Solutions
    Total solutions to pass fine and gross leak cavity packaging
  • Optical Adhesives & Coatings
    Low shrinkage and moisture resistant
  • SMT/PWB Component Attach
    Rapid-curing component attach and conformal coating
  • Dicing- Grinding Tapes
    U.S. made high temperature and UV-releasing tapes
  • Chip-Carrier and Waffle Tray
    Universal JEDEC trays and custom waffle-packs for chips and parts